Solvay Fluor offers a range of chemicals for high performance etching in electronic devices manufacturing. Our liquids (HF and Ammonium Fluoride solutions) complies with the strongest needs for isotropic wet etching.
Sifren® 46, developed with Applied Material, offers the highest performances both in terms of selectivity's and aspect ratios for the most critical dielectric etching processes in nodes below the 0,25µm. Sifren® 46 gas already been successfully tested for 65nm nodes.
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Ammonium Fluoride, 40 %, 10ppb Grade (C)
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Ammonium Fluoride, 40 %, 10 ppb Grade |
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Elemental Fluorine F2 (C)
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Elemental Fluorine (F2) is used to clean CVD tools from silicon deposition within the chamber, which was caused by the CVD process. |
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Hydrofluoric Acid, 49 %, 1ppb Grade (C)
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Hydrofluoric Acid, 49 %, 1 ppb Grade |
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| Hydrofluoric Acid, 49%, 10ppb Grade (C) |
Hydrofluoric Acid, 49%, 10 ppb Grade |
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| Sulphur Hexafluoride SF6 (C) |
SF6 for Use as Etching and Chamber Cleaning Gas Sulphur hexafluoride is more and more used for manufacturing silicon devices by the semiconductor, flat panels, MEMS and photovoltaic industry. It is used to produce processors and memories on mono-crystalline silicon wafers |
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| Sifren® 46 (E) |
Sifren® 46 (C4F6 or Hexafluoro-1,3-butadiene) an unsaturated fluorocarbon with an alternating double bond; produced by Solvay Fluor |
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